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| Name: | Electronic Grade Epoxy Potting Compound for Printed Circuit Boards, Electronic Encapsulation, Waterproofing, Permanent Circuit Masking, None Conductive Epoxy Resin |
| Model: | 9001AB |
| Ratio: | A:B=5:1（weight） |
| Shore hardness: | 85D |
| Mix viscosity: | 500+30MPA.S |
| Colour: | Black,white,clear,etc. |
| Usable time: | 60-120min（25℃） |
| Hardening time: | Initial hardening time:4-18 hours. Final hardening time:24 hours |
| Storage temperature time: | 15-25℃ |
| Performance: | Waterproof, Sealed, Insulated |
| Inquiry |
Electronic Potting and Encapsulating Compound For Printed Circuit Board -Insulate AC/DC High And Low Voltage.
Bonds to ABS PVC Plastic Housing, Wire Jackets, Mold Injected Components, Powder Coated And Metal Substrates.
None Electrically Conductive Epoxy Resin For Waterproofing And Embedding Electronic Components.
None ElectrOpaque Black For Permanent Masking, Room Temperature Curing, 5:1 Mix Ratio, Medium Setting.
Low Viscosity, Self Leveling, Medium Set Time, Cures Very Rigid, Up To 190°F (90°C) Operating Temperature.
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